New control systemSYSTEM800 SE

The new HMI is a state-of-the-art next generation control system that incorporates four concepts.

• Visibility: The calulator on the HMI is large and ezsy to type on, and the monitor display can be divided into two sections.NEW
• Functionality: Various molding drive modes, enabling molding to dedicated machines, have been incorporated.NEW
• Improved operability: Integrated meltcona®,check ring wear diagnosis function and peripheral equipment-linked operation.NEW
• Maintainability: Possible to record the maintenance history directly on the machine.NEW

Check ring wear diagnosis function

Using meltcon®, the viscosity of the resin is measured and quantified. Utilizing the quantified information, we employ a proprietary analysis process to determine the amount of wear of the check ring. This not only helps understand the timing for maintenance but also proves beneficial for production management.

※A separate nozzle block may be required depending on the circumstances.

Mold Clamping Mechanism

High accuracy, high rigidity mold clamping mechanism
To accommodate one-size larger mold

The expansion of the daylight and the widening of the tie-bar spacing have increased the flexibility of mold installation. The increased space also allows for more flexibility in considering mold setup devices, contributing to the improvement of customer production efficiency.

Linear guides provided at the feet of movable components

Optimized shapes of stationary and movable die platens

Linear guides are now standard equipment for mold clamping devices up to Si-450-7. Enhanced rigidity of the mold running surface assures maintaining long-term accuracy and has increased the weight of the installable movable mold platen by an average of 50%.